JPH0392040U - - Google Patents
Info
- Publication number
- JPH0392040U JPH0392040U JP1989152092U JP15209289U JPH0392040U JP H0392040 U JPH0392040 U JP H0392040U JP 1989152092 U JP1989152092 U JP 1989152092U JP 15209289 U JP15209289 U JP 15209289U JP H0392040 U JPH0392040 U JP H0392040U
- Authority
- JP
- Japan
- Prior art keywords
- block body
- inner lead
- block
- holes
- lead bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152092U JPH0392040U (en]) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152092U JPH0392040U (en]) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392040U true JPH0392040U (en]) | 1991-09-19 |
Family
ID=31698368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989152092U Pending JPH0392040U (en]) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392040U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060168A (ja) * | 2006-08-29 | 2008-03-13 | Matsushita Electric Ind Co Ltd | 電子部品の熱圧着装置 |
-
1989
- 1989-12-29 JP JP1989152092U patent/JPH0392040U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060168A (ja) * | 2006-08-29 | 2008-03-13 | Matsushita Electric Ind Co Ltd | 電子部品の熱圧着装置 |